Vapor Phase is the simplest and most reliable method of
soldering. Complex SMT components like QFP, BGA, flip chip
and as well ceramic assemblies can be soldered in the
narrowest process window.

Process Sequence:
Place the boards in the large 20 x 20 inch working area,
then close the clamshell lid. Press start. After the automatic
cooling cycle, simply open the lid and remove your boards.

10 advantages versus other
soldering processes:

• No temperature profiling necessary-
the vapor reflows the solder

• You cannot heat the assembly higher
than the condensing vapor temp

• Repeatable process conditions

• Uniform temperature across the board

• Easily switch from lead to lead free soldering

• Chemistry provides a 100% inert
gas atmosphere

• Oxidation free preheat and soldering

• Delamination of boards eliminated

• Low operating costs

• Little maintenance required

Model VP 500 Specifications:

Max PCB width . . . . . . . . . . . . 500 x 500 mm / 20” x 20”
Max PCB height . . . . . . . . . . . . . . . . . . . 120 mm / 4.7”
Cycle time . . . . . . . . . . . . . . . . . . . . . . . . .. . . . 6 min
Process temperature-adjustable. . . . . max: 260°C / 500°F
Quantity of medium . . . . . . . . . . . . . . . . 2.4 kg / 5.3 lbs
Voltage . . . . . . . . . . . . . . 380V, 50/60 Hz, 3 Phase WYE
Power . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . 5.5 kW
Dimensions . . . . . . .750x750x1100 mm / 30” x 30” x 43.5”
weight . . . . . . . . . . . . . . . . . . . . . . . . .200 kg / 440 lbs


Gold-VP 500 Brochure PDF

FOR MORE INFO SUBMIT THIS CONTACT FORM

Home Reflow Solder Wave Solder Sales Information Agents & Reps. Request Quote
Price List What's New Contact Us About Novastar Frames